Restorative


Shofu Fl Bond Ii 2-Step Self-Etching Bond

FL-Bond II is a 2-step, self-etching, radiopaque, fluoride releasing adhesive system featuring a unique Primer and Bonding Agent to provide an excellent bond to both enamel and dentin with a secure marginal seal for a wide range of anterior and posterior restorations. The 2nd generation Giomer 2-step, self etching, fluoride releasing adhesive system features a unique Primer and Bonding Agent to provide an excellent bond to both enamel and dentin with a secure marginal seal. The FL-Bond II PRIMER contains a new effective adhesion promoting monomer and is acetone free with no incorporation of HEMA to minimize odour and post operative sensitivity. The FL-Bond II BONDING AGENT contains the S-PRG filler (Surface Pre-Reacted Glass-ionomer), which helps to reinforce the bonding interface between the restorative material and tooth structure INDICATIONS: 1. Restoration of deep cavities (in conjunction with aesthetic restorative material) 2. is recommended for bonding any composite to enamel and dentin during restoration of Class I, II, III, IV and V cavities, including cervical erosion 3. Restoration of hypersensitive and exposed root surface. 4. Intraoral repair of fractured indirect restorations when used with M.L. Primer (Metal-Link Primer) and CeraResin Bond 1 (Porcelain Primer) ADVANTAGES: Excellent Handling and Short Application Time: The self-etching primer prepares the enamel and dentin surfaces by modifying the smear layer while eliminating the need for separate etching with Phosphoric acid. All it takes is, 2 simple steps and in just 35 seconds the cavity is ready for immediate placement of restorative materials. Ideal Viscosity & Reliable Adhesion: The unique S-PRG filler (Surface Pre-Reacted Glass-ionomer) in the bonding agent has an ideal viscosity to ensure uniform application with optimal polymerization on the marginal area and cavity walls to provide a secure marginal seal. unlike other single bottle bonding systems can be applied in a wide range of bond thickness 20~80µm while maintaining a stable bond strength.

R1852.8